Cross-Sectional Analysis — Elmet
Cross-section BSE images of the substrate-side IMC layers after thermal... | Download Scientific Diagram
Figure 2 from Investigation of the wetting properties of Cu6Sn5 intermetallic compound | Semantic Scholar
Mounted Part Defects/Reliability Tests of Solder - JFE Techno-Research Corporation
Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Applied Sciences | Free Full-Text | Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock
Microsection | BGA Cross Section Analysis
Cross-Sectional Analysis — Elmet
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
Cross-section BSE images of the interfacial IMC layers before assembly:... | Download Scientific Diagram
Why perform cross-sectional evaluation of circuit boards (PCB)? | Element
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？ | I am a Manufacturing Process Engineer (MPE)
The HDG Coating | American Galvanizers Association
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints | I am a Manufacturing Process Engineer (MPE)
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene | ACS Applied Materials & Interfaces
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging | Scientific Reports
The cross sections of the as-diffusion alloyed intermetallic layer... | Download Scientific Diagram
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient | Scientific Reports
Cross-Sectional Analysis — Elmet
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces | Emerald Insight
The intermetallic layer of solder joints: a) Infrared heating method, | Download Scientific Diagram
